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Title Sensors Expo 2018 -Award Nomination
Writer GENUV Date 2018-05-11 17:07
File E_1559769072.php

Subminiature UV Sensor Components for UV Monitoring

For UV for sterilization and purification, the high energy and the destructive power of UV makes sensor packaging very difficult.  Standard plastic SMD packages do not stand up against the high intensity UV.  Genicom has packaged UV detectors in the metal SMD 3535 surface mount package, but in high volume applications the cost is too high.
To reduce the cost Genicom developed a subminiature UV sensor CSP package (1mm X 1mm X 0.3mm).  This CSP (Chip Scale Package) is really unique.  The substrate and window material are sapphire and the UV sensor is actually grown on the sapphire window using Genicom’s proprietary epi growth technology.  This innovative way of embedding the sensor on the window simplifies the assembly process and significantly lowers production steps, time and cost.  The size of the package is much smaller and thinner too.  And it can be even smaller if the application requires it.  The same CSP sapphire & epi growth technology can be used.
The lower cost and smaller size make it ideal for cost sensitive applications like wearable UV detectors, UV detectors in portable devices like phones and watches and other high volume cost sensitive consumer applications where measuring the UV intensity is desired.